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In the field of electronic product design, laser cutting is the most suitable for the cutting design of 5G circuit boards.

In some cities, the operators have begun to deploy 5G on a large scale. To realize 5G technology, it is inseparable from the use of circuit boards. In the electronics industry, flexible circuit boards can be said to be the blood vessels for electronic products. Especially under the trend of lighter, thinner, miniaturized, wearable, and foldable electronic equipment, flexible circuit boards have the advantages of high wiring density, lightness and thinness, bendable, and three-dimensional assembly, and are appropriately matched to the market development trends.


For processing procedure, the common traditional processing methods include die, milling cutter, stamping and so on. However, this type of mechanical contact splitting process has stress, is prone to burrs, dust, and is not precise enough, so it is gradually replaced by the laser cutting technique. The flexible circuit board laser cutting machine is used as a non-contact processing tool. It can apply high-intensity light energy (650mW/mm2) on a small focal point (100-500UM). Such high energy can be used for laser cutting, drilling, marking, welding, scribing and other various materials.

1. Fiber Laser Cutting Technique

Using a flexible circuit board laser cutting machine to cut PCB/FPC, there is no need to require several molds like traditional stamping, saving time and cost; and laser cutting is a non-contact processing, which eliminates the damage to components in contact processing such as mechanical stamping. To greatly improve the yield rate, the use of laser cutting PCB/FPC is an inevitable trend of development.

1. As the circuit density and pitch of FPC products continue to increase, and the contours of FPC graphics are becoming more and more complex, this makes it more and more difficult to make FPC molds. Laser cutting flexible circuit boards adopts numerical control processing without mold processing to save the cost of mold opening;

2. Due to the lack of mechanical processing, which restricts the processing accuracy, the laser cutting flexible circuit board adopts high-performance ultraviolet laser light source with good beam quality to guarantee better cutting effec;

3. Because the traditional processing technology is a contact machining method. It will inevitably produce processing stress on FPC, which may cause physical damage. Laser cutting of flexible circuit boards is non-contact processing, which effectively avoids damage and deformation of processed materials.



With the development of flexible electronic technology, various electronic product applications have emerged. The application of flexible electronics will drive a trillion-yuan market, assist traditional industries in increasing the added value of the industry, and bring revolutionary changes to the industrial structure and human life.

2. Fiber Laser Marking Technique

The laser marking machine uses a laser beam to make permanent marks on the surface of various materials. The effect of marking is to expose deep material through the evaporation of surface material, thereby engraving exquisite patterns, trademarks and text. Laser marking machines are mainly divided into: fiber laser marking machine, CO2 laser marking machine, and ultraviolet laser marking machine.

At present, laser marking machines are mainly used in some occasions requiring finer and higher precision. There are many market applications such as electronic components, integrated circuits (IC), electrical appliances, mobile communications, hardware products, tool accessories, precision equipment, glasses and watches, jewelry, auto parts, plastic buttons, building materials, handicrafts, PVC pipes, etc.